工業(yè)應用的熱電致冷器的主要應用:
* 工業(yè)電子學和通訊方面的應用
* 具有不同功能的熱電冷卻組件及調節(jié)器
* 碗櫥和電子設備用的熱電致冷器件
* 不同類型機器的關鍵部件和組件的溫度控制系統(tǒng)
* 熱流探測
* 半導體集成為芯片產品
* 激光設備
* 醫(yī)學設備
* 傳送器
* 食品工業(yè)
* 特殊設備
|
To notate thermoelectric coolers with a hole a system of notation of standard single-stage thermoelectric coolers with an index is used:
CH — for rectangular modules with a central hole (for example ТВ-43-1.0-0.8CH)
CHR — for round coolers with a central hole
(for example ТВ-19-1.0-1.3CHR)
R — for round coolers (for example TB-253-1.4-1.5R) |
 |
| Name |
Imax
(A) |
Qmax
(W) |
Umax
(V) |
dTmax
(K) |
R
(Ohm) |
H
(mm) |
D
(mm) |
d
(mm) |
|
TB-21-1.0-1.3CHR |
3.6 |
5.2 |
2.4 |
69 |
0.52 |
3.6 |
15 |
3.0 |
|
|
5.8 |
16.8 |
4.7 |
69 |
0.64 |
3.1 |
24 |
9.8 |
|
|
3.6 |
10.3 |
4.7 |
69 |
1.05 |
3.6 |
24 |
9.8 |
|
|
3.1 |
8.9 |
4.7 |
69 |
1.12 |
3.8 |
24 |
9.8 |
|
|
5.8 |
19.0 |
5.3 |
69 |
0.70 |
3.1 |
24 |
5.0 |
STANDARD TERMS OF DELIVERY:
— substrate material — alumina (ВК-96)
— height tolerance ± 0,05 mm (L1)
— parallelism 0,03 mm (L1)
— wire length 120 mm
— pin orientation (for rectangular coolers) — to the longer side
— processing temperature up to 80°С, maximal assembly temperature 120°С (assembly solder Tm = 139°С)
ADDITIONAL OPTIONS
|
Description |
Notation (*) |
Note |
| processing temperature up to 120 °C, max assembly temperature = 130 °C |
HT(120) |
assembly solder with Tm = 139 °C |
| processing temperature up to 150 °C, max assembly temperature = 170 °C |
HT(150) |
assembly solder Pb-Sn with Tm = 183 °C |
| processing temperature up to 200 °C, max assembly temperature = 220 °C |
HT(200) |
assembly solder with Tm = 232 °C |
| special version for operation under conditions of temperature cycling |
С |
> 105 cycles +40C/+90 °C |
| height tolerance = ± 0.025 mm and parallelism 0.02 mm |
L2 |
|
| height tolerance = ± 0.015 mm and parallelism 0.01 mm |
L3 |
|
| metallization of cold (mc) and (or) hot side of cooler with solder tinning (melting temperature = 95 °C, 117 °C, 139 °C, 183 °C) |
mc95, mh95, mm117 etc. |
|
| gold plating |
mcAu, mhAu, mmAu |
metallization Cu-Ni-Au (0.2-1 micron) |
| substrate material – aluminium nitride (AlN) |
N |
heat conductivity > 180 W/mK |
| sealant: epoxy, silicon, urethane, conformal coating |
E, S, U, Сс |
|
| non-standard pin orientation |
|
|
| type and length of wires by customer’s requirement |
|
|
| сonnection to arraies |
|
|
| сonnectors crimping |
|
|
| soldering on cold or hot heatsink, packaging or cold block |
|
|
縮寫詞的定義：
TEC: 熱電致冷器
TGM: 熱電模塊
ΔTmax：熱電致冷器的熱面和冷面之間可實現(xiàn)的最大溫差。
Imax：輸入電流到熱電致冷器導致最大的ΔTmax
Umax： 在Δtmax，熱電致冷器接觸的電壓
Qmax：熱電致冷器的最大冷卻能力。當熱電致冷器的熱面和冷面之間保持溫差為零，逐漸升高熱電致冷器的電流到最大電流Imax。此時，熱電致冷器達到最大冷卻能力。
Rac： 在1KHz的交流電測得的熱電致冷器的電阻。
工業(yè)應用的致冷器
系統(tǒng)符號說明:
通用的縮寫被用于標記單級致冷器：
ТВ-N-C-h, 表示:
ТВ — 產品縮寫：熱電池 (致冷器)。
N — 在制冷器中熱電偶的對數(shù)
С — 基于熱電偶條數(shù)的肋骨長度(用毫米表示)
h —基于熱電偶條數(shù)的高度(用毫米表示)
例如：TB-161-1.4-1.5模塊: 161是熱電偶對數(shù)，(322是熱電偶的元素)
每個元素都有1.4mm x 1.4mm的橫截面積, 高是1.5mm。 |
