工業(yè)應(yīng)用的熱電致冷器的主要應(yīng)用:
* 工業(yè)電子學(xué)和通訊方面的應(yīng)用
* 具有不同功能的熱電冷卻組件及調(diào)節(jié)器
* 碗櫥和電子設(shè)備用的熱電致冷器件
* 不同類型機(jī)器的關(guān)鍵部件和組件的溫度控制系統(tǒng)
* 熱流探測(cè)
* 半導(dǎo)體集成為芯片產(chǎn)品
* 激光設(shè)備
* 醫(yī)學(xué)設(shè)備
* 傳送器
* 食品工業(yè)
* 特殊設(shè)備
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To notate thermoelectric coolers with a hole a system of notation of standard single-stage thermoelectric coolers with an index is used:
CH — for rectangular modules with a central hole (for example ТВ-43-1.0-0.8CH)
CHR — for round coolers with a central hole
(for example ТВ-19-1.0-1.3CHR)
R — for round coolers (for example TB-253-1.4-1.5R) |
 |
| Name |
Imax
(A) |
Qmax
(W) |
Umax
(V) |
dTmax
(K) |
R
(Ohm) |
A
(mm) |
B
(mm) |
H
(mm) |
D
(mm) |
|
|
3.1 |
9.6 |
5.1 |
69 |
1.20 |
20.0 |
20.0 |
3.8 |
6.5 |
|
TB-41-1.0-0.8CH |
5.7 |
18.6 |
5.3 |
68 |
0.70 |
22.5 |
17.5 |
3.1 |
9.5 |
|
TB-41-1.0-1.3CH |
3.6 |
11.7 |
5.3 |
69 |
1.10 |
22.5 |
17.5 |
3.6 |
9.5 |
|
|
3.6 |
32.3 |
14.7 |
69 |
3.10 |
30.0 |
30.0 |
3.6 |
4.0 |
|
|
3.1 |
28.0 |
14.7 |
69 |
3.40 |
30.0 |
30.0 |
3.8 |
4.0 |
|
|
2.3 |
21.0 |
14.7 |
69 |
4.90 |
30.0 |
30.0 |
4.3 |
4.0 |
|
TB-41-1.4-1.1CH |
8.2 |
25.1 |
5.0 |
69 |
0.45 |
23.0 |
23.0 |
3.6 |
9.5 |
|
|
6.1 |
51.0 |
13.7 |
70 |
1.80 |
40.0 |
40.0 |
4.0 |
13.0 |
|
|
7.9 |
72.0 |
14.7 |
69 |
1.40 |
40.0 |
40.0 |
3.4 |
7.8 |
|
|
6.1 |
56.0 |
14.9 |
70 |
1.90 |
40.0 |
40.0 |
3.9 |
7.8 |
|
|
3.7 |
35.1 |
15.3 |
72 |
3.00 |
40.0 |
40.0 |
4.8 |
7.8 |
|
|
7.9 |
75.0 |
15.5 |
69 |
1.50 |
40.0 |
40.0 |
3.4 |
4.7 |
|
|
6.1 |
59.0 |
15.7 |
70 |
2.00 |
40.0 |
40.0 |
3.9 |
4.7 |
|
|
3.7 |
36.8 |
16.0 |
72 |
3.10 |
40.0 |
40.0 |
4.8 |
4.7 |
STANDARD TERMS OF DELIVERY:
— substrate material — alumina (ВК-96)
— height tolerance ± 0,05 mm (L1)
— parallelism 0,03 mm (L1)
— wire length 120 mm
— pin orientation (for rectangular coolers) — to the longer side
— processing temperature up to 80°С, maximal assembly temperature 120°С (assembly solder Tm = 139°С)
ADDITIONAL OPTIONS
|
Description |
Notation (*) |
Note |
| processing temperature up to 120 °C, max assembly temperature = 130 °C |
HT(120) |
assembly solder with Tm = 139 °C |
| processing temperature up to 150 °C, max assembly temperature = 170 °C |
HT(150) |
assembly solder Pb-Sn with Tm = 183 °C |
| processing temperature up to 200 °C, max assembly temperature = 220 °C |
HT(200) |
assembly solder with Tm = 232 °C |
| special version for operation under conditions of temperature cycling |
С |
> 105 cycles +40C/+90 °C |
| height tolerance = ± 0.025 mm and parallelism 0.02 mm |
L2 |
|
| height tolerance = ± 0.015 mm and parallelism 0.01 mm |
L3 |
|
| metallization of cold (mc) and (or) hot side of cooler with solder tinning (melting temperature = 95 °C, 117 °C, 139 °C, 183 °C) |
mc95, mh95, mm117 etc. |
|
| gold plating |
mcAu, mhAu, mmAu |
metallization Cu-Ni-Au (0.2-1 micron) |
| substrate material – aluminium nitride (AlN) |
N |
heat conductivity > 180 W/mK |
| sealant: epoxy, silicon, urethane, conformal coating |
E, S, U, Сс |
|
| non-standard pin orientation |
|
|
| type and length of wires by customer’s requirement |
|
|
| сonnection to arraies |
|
|
| сonnectors crimping |
|
|
,
| soldering on cold or hot heatsink, packaging or cold block |
|
|
縮寫詞的定義：
TEC: 熱電致冷器
TGM: 熱電模塊
ΔTmax：熱電致冷器的熱面和冷面之間可實(shí)現(xiàn)的最大溫差。
Imax：輸入電流到熱電致冷器導(dǎo)致最大的ΔTmax
Umax： 在Δtmax，熱電致冷器接觸的電壓
Qmax：熱電致冷器的最大冷卻能力。當(dāng)熱電致冷器的熱面和冷面之間保持溫差為零，逐漸升高熱電致冷器的電流到最大電流Imax。此時(shí)，熱電致冷器達(dá)到最大冷卻能力。
Rac： 在1KHz的交流電測(cè)得的熱電致冷器的電阻。
工業(yè)應(yīng)用的致冷器
系統(tǒng)符號(hào)說(shuō)明:
通用的縮寫被用于標(biāo)記單級(jí)致冷器：
ТВ-N-C-h, 表示:
ТВ — 產(chǎn)品縮寫：熱電池 (致冷器)。
N — 在制冷器中熱電偶的對(duì)數(shù)
С — 基于熱電偶條數(shù)的肋骨長(zhǎng)度(用毫米表示)
h —基于熱電偶條數(shù)的高度(用毫米表示)
例如：TB-161-1.4-1.5模塊: 161是熱電偶對(duì)數(shù)，(322是熱電偶的元素)
每個(gè)元素都有1.4mm x 1.4mm的橫截面積, 高是1.5mm。 |
