STANDARD TERMS OF DELIVERY:
— substrate material — alumina (ВК-96)
— height tolerance ± 0,05 mm (L1)
— parallelism 0,03 mm (L1)
— wire length 120 mm
— pin orientation (for rectangular coolers) — to the longer side
— processing temperature up to 80°С, maximal assembly temperature 120°С (assembly solder Tm = 139°С)
ADDITIONAL OPTIONS
|
Description |
Notation (*) |
Note |
| processing temperature up to 120 °C, max assembly temperature = 130 °C |
HT(120) |
assembly solder with Tm = 139 °C |
| processing temperature up to 150 °C, max assembly temperature = 170 °C |
HT(150) |
assembly solder Pb-Sn with Tm = 183 °C |
| processing temperature up to 200 °C, max assembly temperature = 220 °C |
HT(200) |
assembly solder with Tm = 232 °C |
| special version for operation under conditions of temperature cycling |
С |
> 105 cycles +40C/+90 °C |
| height tolerance = ± 0.025 mm and parallelism 0.02 mm |
L2 |
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| height tolerance = ± 0.015 mm and parallelism 0.01 mm |
L3 |
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| metallization of cold (mc) and (or) hot side of cooler with solder tinning (melting temperature = 95 °C, 117 °C, 139 °C, 183 °C) |
mc95, mh95, mm117 etc. |
|
| gold plating |
mcAu, mhAu, mmAu |
metallization Cu-Ni-Au (0.2-1 micron) |
| substrate material – aluminium nitride (AlN) |
N |
heat conductivity > 180 W/mK |
| sealant: epoxy, silicon, urethane, conformal coating |
E, S, U, Сс |
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| non-standard pin orientation |
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| type and length of wires by customer’s requirement |
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| сonnection to arraies |
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| сonnectors crimping |
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| soldering on cold or hot heatsink, packaging or cold block |
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